Passed the quality management system certification reassessment on Feb 24, 2022;
Obtained the national high-tech enterprise reassessment certificate on August 17, 2020;
In September 2020, it won the honorary title of municipal-level "specialized, refined, special and new" enterprise (recognized in 2020);
The company has a number of self-developed utility model patents.
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Tongling Yuanyi Precision Machinery Co., Ltd.
Tel：+86 Tel：+86
E-mail：
Address: 129 west Cuihu road 5, Tongling Economic Development Zone, Anhui Province
National service hotline:
CAVITY BAR TOP
BTM CAVITY BLOCK
TOP CAVITY BLOCK
SOT Series Cavity Bar for Packaging Mold
Integrated Circuit Plastic Mold Insert SMF Series
BGA mold chase
Die for IC chip PD5060
DIP sliding cover
Runner plate
Base of BTM cavtiy bar
Cavity bar
Toothed punch
BTM cavity block
Welding head
Bending die
Auto mold chase
Top mask
Cutting die
BTM Cavity Bar
IC Die
Precision accessories
QFN package mold insert
Punch die
tungsten steel claw
Molded insert TO247
Trim parts
Gate pin
SOT mold for semiconductor packaging
test table gripper
IC molded parts
Molded insert for semiconductor packaging die (top)
Single crystal substrate
Punching
Forming cavity (insert) under semiconductor package
SOT553 runner for plastic die of semiconductor chip
Punch
Spring piece
Molded insert in semiconductor package (TO92)
Die
Pressure claw
Die box for mould sealing of semiconductor and integrated circuit
Semiconductor and integrated circuit gate runner mold (lower)
Cutting egde part
Cutting tool die for plastic sealing die of integrated circuit
Semiconductor gate runner mold
Semiconductor and integrated circuit gate runner mold (top)
Coating pot
Tungsten steel Pot/Plunger
Big pot plunger
Surface coating plunger
Semiconductor and integrated circuit plastic packaging tray mold
Pot for Semiconductor and Integrated Circuit Plastic Packaging Mould
Plunger for Semiconductor and Integrated Circuit Plastic Packaging Mould
Spiral plunger
Plunger for Semiconductor and Integrated Circuit Plastic Packaging Mould
Pot for Semiconductor and Integrated Circuit Plastic Packaging Mould
Pot for Semiconductor and Integrated Circuit Plastic Packaging Mould
Chinese Station
English Station